Electronics Manufacturing

Seoul – September 12, 2026 -- DB HiTek has completed reliability qualification testing for its 1,200V silicon carbide (SiC) MOSFET process on 8-inch (200mm) wafers, establishing what the company calls the world's first full-service process for 8-inch SiC semiconductor production.

DB HiTek targets 2027 mass production launch for 8-inch SiC wafers

The South Korean specialty foundry plans to open the process to existing customers in the third quarter of this year and extend availability to all clients starting in the second quarter of 2027. The move addresses a shift among major global chipmakers from 6-inch to 8-inch SiC wafers to cut production costs and improve manufacturing efficiency, a transition driven by SiC's superior performance over silicon in high-voltage, high-temperature applications used in electric vehicles, renewable energy systems and industrial power equipment.

Seoul – September 12, 2026 -- DB HiTek has completed reliability qualification for its 1200V silicon carbide (SiC) MOSFET process on 8-inch (200mm) wafers, becoming the first foundry to build a complete process chain for 8-inch SiC MOSFET production at this voltage class. The South Korean pure-play foundry plans to launch mass production in 2027, targeting the electric vehicle, renewable energy and industrial power electronics markets.

DB HiTek builds world-first 8-inch SiC foundry process chain

The company developed an end-to-end foundry process covering design, manufacturing, electrical characterization and reliability qualification for 8-inch SiC MOSFET devices rated at 1200V. Most SiC wafer production today runs on 6-inch substrates, but major chipmakers are shifting to 8-inch wafers to cut costs and improve manufacturing efficiency, a transition DB HiTek says it is positioned to capture.

Taipei – September 12, 2026 -- ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711) has released its unaudited consolidated net revenues for August 2026, covering its assembly, testing and material (ATM) business segment.

ASE Technology confirms monthly disclosure required under Taiwan regulatory rules

The Taipei-based semiconductor packaging and testing provider issued the filing to comply with Taiwan regulatory requirements governing monthly revenue reporting for listed companies. The disclosure applies specifically to net revenues generated from ASE's outsourced semiconductor assembly, testing and materials operations for the month.

Edinburgh – September 12, 2026 -- Dukosi Ltd has appointed Graeme Cook as its first Chief Financial Officer, a move tied to the company's plan to ramp production of its battery cell monitoring technology.

Cook moves from interim to permanent CFO after eight months in the role

Cook, a Chartered Accountant with more than 25 years of senior management experience in the semiconductor, electronics and software development sectors, had served as Dukosi's interim CFO for eight months before the permanent appointment. CEO Mark Pinto said Cook is joining at a critical stage as the company executes on commercializing its Dukosi Cell Monitoring System (DKCMS®) and C-SynQ® communication protocol.

Pleasanton, Calif. – September 12, 2026 -- Alif Semiconductor launched a new family of low-cost evaluation boards priced at an MSRP of $49, aimed at lowering the barrier to on-device AI/ML inference for developers.

StartKit boards target two MCU families for edge AI development

The SK-E1C board supports Alif's Ensemble microcontrollers, while the SK-B1 targets the BLE wireless Balletto family. Both boards ship with a superset configuration combining a 160MHz Arm Cortex-M55 CPU core with Helium vector processing extension, an Ethos-U55 NPU, and 2MB of tightly coupled SRAM and MRAM.

NPU delivers inference speeds up to two orders of magnitude faster than traditional MCUs

Alif states the Ethos-U55 NPU included in both boards accelerates inference performance by up to 100x compared to running identical workloads on a conventional MCU core, positioning the StartKit line for battery-powered, always-on AI applications.

Windsor, Calif. – September 12, 2026 -- Stäubli will present electrical and fluid connectivity solutions for semiconductor tool manufacturers at Semicon West in San Francisco this October, as chipmakers push suppliers to cut equipment qualification times and boost tool uptime.

Connector reliability targets over 100,000 duty cycles to protect yield

Stäubli's electrical connectors are engineered to maintain contact integrity across more than 100,000 cycles, operate at temperatures up to 350°C, and support lifecycle demands exceeding 10 years. The company states its RF precision components are built to stabilize plasma processes used in fabrication, addressing a persistent risk point where minor connectivity variance can degrade yield.

Berlin – September 10, 2026 -- Morpho, a UV printing technology company, unveiled its first UV desktop printer at IFA 2026 in Hall 17-196, following a Kickstarter campaign that surpassed $10 million from more than 2,800 backers worldwide.

Morpho's UV printer applies industrial-grade color and texture to wood, glass, leather and metal

The device is G7 Master ColorSpace certified, a standard Morpho says ensures consistent color reproduction across different materials. Its industrial-grade print head layers fine ink deposits to create tactile, relief-style surfaces while operating at carriage speeds of up to 600 mm/s.

Johannesburg – September 11, 2026 -- Tongxin Microelectronics (TMC TONGXIN MICRO) has shipped over 27 billion chips globally and secured the digital identities of more than 1 billion citizens worldwide, the company disclosed at Seamless Africa 2026, held September 8-9.

China-developed chip achieves CC EAL6+ certification for global payment networks

TMC TONGXIN MICRO presented its THD89 Family, which it says is the first China-developed security chip to receive CC EAL6+ certification. The series secures payment cards for UnionPay, Visa, Mastercard and JCB, covering hundreds of millions of cardholders.

RISC-V based chip enters mass production at Chinese banks

The company also showcased the E450R, described as the world's first open architecture security chip, built on RISC-V hardware and its OpenPlatform software. State-owned and joint-stock banks in China have already deployed tens of millions of units.

Berlin – September 11, 2026 -- BOE Technology opened its first overseas Innovation Partner Conference (IPC) in Berlin on September 7, 2026, running alongside the IFA 2026 electronics show, with more than 200 global display and IoT partners invited to attend.

BOE stages its first international IPC forum to court European and global partners

The event, themed around innovation, globalization and collaboration, marked the first time BOE has hosted its Innovation Partner Conference outside China. The company built a technology showcase around a concept it calls "LIGHT" -- an acronym covering low power consumption, innovative technology, global service, high performance and superior quality -- to demonstrate scenario-based solutions tailored to the European market.

Berlin – September 11, 2026 -- BOE Technology Group opened its first international Innovation Partner Conference (IPC) outside China on September 7, 2026, in Berlin, drawing more than 200 partners to coincide with IFA 2026 under the theme "Innovation, Globalization, Collaboration."

BOE Stages First Overseas IPC Forum Alongside IFA Berlin

The BOE IPC Europe 2026 marked the first time the company's global ecosystem event for display and IoT partners was held abroad. The gathering brought together partners from across Europe and beyond to discuss display-industry trends and collaboration opportunities.