Electronics Manufacturing

BILLERICA – October 22, 2026 -- E Ink and FUJIFILM Imaging Systems Co., Ltd. plan to start mass production of a 55-inch color ePaper signage display in March 2027, aiming to replace printed posters in Japan's railway industry.

Two Marquee formats are scheduled through January 2028

The 55-inch E Ink Marquee will reach prototype stage in December 2026. The larger B1-size E Ink Marquee follows with prototypes in October 2027 and mass production in January 2028. The companies will introduce select sizes in 2027 only after prototype assessments are completed successfully.

Labor shortages and print costs drive railway demand for ePaper

Railway operators are turning to ePaper because of labor shortages and rising costs to print, transport, install and dispose of traditional paper posters, according to the companies.

Migdal Ha'Emek – October 22, 2026 -- Camtek Ltd. (Nasdaq: CAMT; TASE: CAMT) will publish its third quarter 2026 results on Wednesday, October 22, 2026, the semiconductor inspection and metrology equipment maker announced.

Camtek schedules Zoom call for 9:00 am ET on results day

Management will present the results in a video conference call on Zoom later the same day, starting at 9:00 am ET. Chief Executive Officer Rafi Amit, Chief Financial Officer Moshe Eisenberg and President and Chief Operating Officer Ramy Langer will host. They will give a few opening remarks, present the figures and then take questions.

Participants must register in advance to receive access links

Registrants receive a link to the call after signing up. The call is accessible through the Zoom app or by dial-in telephone number. Camtek's investor relations team handles registration problems, and the company advises contacting it well in advance of the call.

Munich – October 21, 2026 -- SINBON Electronics will exhibit at two German trade fairs in November 2026, electronica in Munich (November 10-13) and SPS Smart Production Solutions in Nuremberg (November 24-26), to present customized interconnect and system integration solutions for energy, mobility, automation and AI infrastructure.

SINBON targets AI servers, solar, EV charging and robotics at electronica

At electronica, at Messe München, Hall A3, Booth 341, the company will show products across several end markets. Customized connectors for AI servers, cabling for solar and energy storage systems, and EV charging cables are on the list. So are battery swapping cabinets for vehicles and autonomous devices, diagnostic imaging cables, and interconnect solutions for collaborative robots.

Tokyo – October 21, 2026 -- A four-company consortium led by NTT Innovative Devices has been selected for a NEDO-backed project to build mass-production technologies for optical chiplets, with a target of more than a tenfold gain in manufacturing productivity over current R&D-stage processes.

Four manufacturers join the NEDO-selected consortium

The members are NTT Innovative Devices, Japan Semiconductor Corporation, Furukawa Electric and Shinko Electric Industries. NTT, Inc. participates as an advisor. The project falls under the New Energy and Industrial Technology Development Organization's program for enhanced post-5G information and communication infrastructure, specifically its development of manufacturing technologies for advanced semiconductors. Japan Semiconductor is a wholly owned subsidiary of Toshiba Electronic Devices & Storage Corporation.

London – October 19, 2026 -- The global 3D through-silicon-via (TSV) and 2.5D packaging market will grow from USD 9.46 billion in 2025 to USD 21.50 billion by 2035, according to Credence Research. That implies a compound annual growth rate of 8.50% for 2026-2035. The figures are the firm's proprietary model estimates, not audited supplier sales totals.

HBM and data centers account for the largest share of spending

High-bandwidth memory (HBM) and other memory made up 46.0% of 2025 application revenue. Data centers and high-performance computing held 55.0% of end-use spending. By technology, 2.5D integration led with 38.0% of 2025 value, and die-to-wafer integration accounted for 48.0%.

Tokyo – October 19, 2026 -- Cellid Inc. has placed its AR glasses reference design, built on proprietary waveguide technology, in the Computer History Museum's new "Extended Reality: Visions of the Future" exhibit, alongside disassembled components of its HJ1 AI Smart Glasses.

Exhibit runs October 1, 2026 to March 28, 2027 in Mountain View

The Computer History Museum (CHM) opened the show on October 1, 2026, in Mountain View, California. It closes on March 28, 2027. The exhibit brings together more than 100 devices and artifacts spanning six decades of innovation in virtual, augmented and mixed reality, smart glasses and AI-powered wearables.

Cellid's items sit alongside contemporary smart glasses and earlier extended reality systems. The curators frame the display around advances in miniaturization, ergonomics, artificial intelligence and wearable technology.

San Jose – October 19, 2026 -- PUFsecurity, a subsidiary of eMemory Technology, has received OCP S.A.F.E. approval for its PUFrt root-of-trust IP after an independent Scope 3 security assessment, and the product is now listed on the OCP Marketplace.

The company presented PUFrt at Microsoft's Caliptra Workshop on October 12, the opening day of the sold-out 2026 OCP Global Summit. The workshop drew nearly 400 attendees. Principal Security Architect Kent Chuang spoke on moving the open-source Caliptra specification into production-ready silicon for AI data centers.

Shenzhen – October 16, 2026 -- C-TOUCH & DISPLAY SHENZHEN, FILM & TAPE EXPO and a wider program of co-located industrial technology exhibitions will run October 27-29, 2026, at the Shenzhen World Exhibition & Convention Center, with a 240-hour visa-free transit policy open to eligible visitors from 57 countries.

C-TOUCH & DISPLAY features a TGV glass substrate zone in Hall 16

C-TOUCH & DISPLAY SHENZHEN 2026 will cover AI+AR smart glasses, Micro LED, OLED, automotive displays, smart cockpits and advanced semiconductor packaging.

The TGV Glass Substrate Advanced Packaging Zone in Hall 16 will show manufacturing processes spanning glass materials, micro-via processing, metallization, copper filling and inspection. Industry conferences will address AI computing and optical interconnection, smart glasses, TGV technology and emerging display applications.

Spokane – October 15, 2026 -- AV Access has launched the 8KEX100-KVM, an HDMI 2.1 KVM extender that carries 8K@60Hz and 4K@120Hz video plus USB signals up to 100m (328ft) over a single Cat 6/6A/7 cable.

The product is now available to professional users and system integrators. It supports HDMI 2.1 and HDCP 2.3.

Single-cable design with Power over Cable cuts installation complexity

The extender runs on one Cat cable and supports Power over Cable (PoC), which AV Access says reduces cable complexity. Further features include USB 2.0 connectivity, RS-232 passthrough and EDID management for professional AV deployments.

Cambridge – October 15, 2026 -- Bulgin, an Infinite Electronics company, has added hybrid circular connectors to its 6000 Series Buccaneer range, combining two 16 A power contacts and 3 A signal contacts in one IP68-rated housing.

Hybrid design removes the need for separate power and signal cable routing

The 6000 Series Hybrid Buccaneer is aimed at smaller devices such as test and measurement equipment, sensors and control systems. Integrating both connection types in a single interface cuts space requirements and eliminates separate cable routing for power and signal.

Two central power contacts are rated at 16 A. Designers can choose from three configurations with two, four or six 3 A signal contacts.

Mark Berry, VP of Product & Portfolio Management at Infinite Electronics, said the company integrated high-current power and signal channels into one sealed interface to deliver a smaller footprint without compromising performance.