Manufacturing & Industrial Technology

SHANGHAI – November 05, 2026 -- NSING Technologies has shipped more than 250 million Bluetooth chips incorporating Ceva-Waves Bluetooth Low Energy (LE) IP, licensor Ceva, Inc. (NASDAQ: CEVA) announced.

NSING builds its Bluetooth portfolio on Ceva's licensed connectivity IP

The Chinese semiconductor company combines Ceva's Bluetooth LE technology with its own low-power RF designs and MCU architectures. According to Ceva, this approach shortened product development and kept performance and standards compliance consistent across successive product generations.

KYOTO – November 05, 2026 -- Nuvoton Technology Corporation Japan (NTCJ) and Qt Group (Nasdaq Helsinki: QTCOM) have added Nuvoton's Gerda HMI controller platform as target hardware for Qt for MCUs, enabling premium graphical interfaces without external memory.

Built-in RAM removes external memory from the bill of materials

Gerda's large built-in RAM and its display, connectivity and control interfaces allow standalone HMI systems with no external memory. Qt for MCUs' graphics optimization and Gerda's texture compression shrink the GUI memory footprint. The companies say the result is a lower component count and lower total system cost, which matters most in high-volume products.

Target applications range from automotive and motorcycle instrument clusters and head-up displays to home appliance display panels. The companies demonstrated a motorcycle instrument cluster and a washing machine interface.

TAIPEI – November 05, 2026 -- Taiwan-based GaNrich Semiconductor has built a gallium nitride (GaN) power device portfolio covering 40V to 1200V on both GaN-on-Si and GaN-on-Sapphire platforms. The company says it is currently the only GaN designer able to supply mass-production GaN product for customer validation in Taiwan.

GaNrich covers low-mid and high voltage ranges for AI data centers and EVs

The 40V-250V line targets applications where traditional silicon devices have reached their performance limits. GaNrich has completed development of 5x6, 5x3 and 3x3 packages that are compatible with existing standard silicon devices. It also integrates gate drivers into the same package to simplify circuit design.

Dortmund, Germany – November 05, 2026 -- RingConn, a smart ring maker founded in 2021, has become Premium Partner of Borussia Dortmund's women's football team, with some players receiving RingConn Gen 3 smart rings for continued use.

Gen 3 rings go to BVB players for everyday use

Under the agreement, some Borussia Dortmund players will wear the RingConn Gen 3 as part of their daily routines. RingConn says the ring is designed for continuous wear and provides health and wellness insights through a connected experience. The company says the insights help users understand their personal health metrics and natural rhythms over time.

Wayne, Pennsylvania – November 04, 2026 -- Ecovyst Inc. (NYSE: ECVT) will review its third quarter 2026 financial results on a conference call and audio-only webcast on Thursday, November 5, 2026, at 11:00 a.m. Eastern Time.

Ecovyst issues corrected Meeting ID for the November 5 investor call

The company reissued its announcement after an earlier version carried an incorrect Meeting ID. The corrected ID is 344343271. Investors can dial in at 1 (833) 461-5787 (USA toll-free) or 1 (585) 542-9983 (international toll).

Ecovyst offers an audio-only webcast with presentation materials and a replay

The webcast will include presentation materials. A replay of the call and webcast will be available on the company's investor relations site after the event.

Fort Wayne – November 04, 2026 -- Bob Lauter, chairman of MasterSpas and co-founder of the company in 1996, has been named a 2026 inductee into the Hot Tub Hall of Fame. He will be inducted on Monday, November 16, 2026, at the PHTA Awards of Excellence at the Ernest N. Morial Convention Center in New Orleans.

Lauter joins Aqua Quip's Brian Quint as 2026 honoree

Quint, former co-owner and president of Seattle-area retailer Aqua Quip, will be inducted alongside Lauter. SpaRetailer magazine created the Hall of Fame in 2024 with the International Hot Tub Association. It recognizes people across manufacturing, retail, supply, associations and support services who helped advance, improve or protect the industry.

TAICHUNG – November 04, 2026 -- Winbond Electronics Corporation has released a CRA Conformance and Integration Kit for its TrustME W77Q Secure Flash family, bundling hardware, software, testing resources, reference designs and security evidence to help manufacturers prepare for the European Union's Cyber Resilience Act (CRA).

W77Q Secure Flash carries SESIP Level 2 certification, but not product-level CRA conformity

The CRA sets cybersecurity requirements across the lifecycle of products with digital elements, including secure design and development, production, vulnerability handling, software maintenance and technical documentation. W77Q has achieved SESIP Level 2 certification, giving customers independently assessed evidence for their own compliance work. Winbond states that component-level certification does not by itself establish CRA conformity of a finished product.

GRAND RAPIDS, Mich. – November 04, 2026 -- UFP Industries, Inc. (Nasdaq: UFPI) has named Scott Worthington, president of UFP Packaging, as vice president of investor relations. He begins transitioning into the new role in November.

Worthington succeeds Stanley Elliott, who is leaving UFP for a role outside the company

Elliott, UFP's director of investor relations, has accepted a position elsewhere. According to the company, he helped strengthen UFP's investor relations infrastructure and expand its engagement with the investment community during his tenure.

CFO Mike Cole thanked Elliott for his work and for the relationships he built across the investment community.

Rockville, Md. – November 04, 2026 -- More than ten customers are already licensing Ceva's Bluetooth High Data Throughput (HDT) IP, the chip-IP vendor said, as the technology debuts in the newly adopted Bluetooth Core 7.0 specification. Ceva (NASDAQ: CEVA) said HDT delivers nearly four times the previous maximum Bluetooth throughput, with higher capacity, better energy efficiency and improved reliability.

Bluetooth Core 7.0 extends Bluetooth LE to data-intensive applications

HDT expands Bluetooth Low Energy to cover high-resolution and lossless wireless audio, immersive and spatial computing, AI-enabled devices and advanced industrial systems. Transferring more data in less time also cuts energy use, according to Ceva.

Saint Paul – November 03, 2026 -- The 3M Board of Directors (NYSE: MMM) authorized the repurchase of up to $6.0 billion of the company's outstanding common stock, bringing total capacity under its repurchase program to $7.5 billion.

3M adds $6.0 billion to $1.5 billion left under its 2025 authorization

The new authorization comes on top of the $1.5 billion remaining under 3M's existing 2025 repurchase authorization. The combined $7.5 billion has no pre-established closing date, so the company sets no deadline for deploying the capital.

Board declares $0.78 per-share dividend for fourth quarter 2026

The board also declared a fourth-quarter 2026 common stock dividend of $0.78 per share. It is payable Dec. 11, 2026, to shareholders of record at the close of business on Nov. 13, 2026.

3M has paid dividends without interruption for more than 100 years.