Electronics Manufacturing

Synopsys, TSMC Expand A14, CoWoS and Agentic AI Chip Design Tools

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Synopsys, TSMC Expand A14, CoWoS and Agentic AI Chip Design Tools

Sunnyvale, Calif. – September 24, 2026 -- Synopsys (Nasdaq: SNPS) has certified its EDA flows on TSMC's A14 process node and expanded a multi-die design collaboration covering agentic AI workflows, integrated voltage regulators on CoWoS® packaging, and co-packaged optics support for TSMC's COUPETM technology.

A14 certification covers digital and analog flows for next-generation chip designs

Synopsys said its certified flows now span implementation through signoff on TSMC's A14 node, including a new device routing enablement milestone for analog place-and-route automation. The companies frame the milestone as critical to speeding customer adoption of advanced process technology for AI and HPC applications.

GSME, Teradyne Launch Test Center for AI, Auto Chips in Q4 2026

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GSME, Teradyne Launch Test Center for AI, Auto Chips in Q4 2026

San Jose, Calif. – September 22, 2026 -- GS Microelectronics U.S. (GSME) and Teradyne, Inc. (NASDAQ: TER) have signed a multi-year strategic partnership to build a semiconductor test and evaluation center at GSME's new 42,000-square-foot Silicon Valley headquarters, with the facility set to open in Q4 2026.

GSME will run a dedicated Teradyne-equipped test floor for next-generation chips

The center will deploy Teradyne's latest test handlers, probers, and automated test systems to support customer demonstrations, device evaluations, engineering development, pilot production, and technical training. Target applications include AI hyperscaler devices, silicon photonics, automotive semiconductors, power management, and RF technologies.

Ezurio Launches BL54LM20 Modules With First Built-In Edge AI

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Ezurio Launches BL54LM20 Modules With First Built-In Edge AI

Akron, Ohio – September 22, 2026 -- Ezurio has introduced the BL54LM20 Series, marking the first time its BL54L module line integrates Edge AI processing directly on the chip. The series includes three products: the BL54LM20A, the BL54LM20B, and a BL54LM20B USB-C Adapter, all built on Nordic Semiconductor's new nRF54LM20A and nRF54LM20B system-on-chips.

New modules pair dual processors with expanded memory for larger IoT applications

Each module combines a 128 MHz Arm Cortex-M33 application processor with a 128 MHz RISC-V coprocessor, backed by 2 MB of non-volatile memory and 512 KB of RAM. The BL54LM20A supports Bluetooth LE Core 6.x, 802.15.4 for Thread/Matter, and NFC within an 11 x 8 x 1.8 mm footprint, alongside Secure Boot, Secure Firmware Update, and Secure Storage.

AKA's EOS Sales AI Completes Pilot With Major Electronics Firm

Seoul, South Korea – September 22, 2026 -- AKA, a cognitive AI company, has completed an enterprise pilot of its EOS Sales Knowledge Engine with one of the world's largest consumer electronics companies, demonstrating measurable gains in sales knowledge accuracy and evaluation consistency across large, geographically dispersed retail and reseller networks.

EOS verifies sales claims against product documentation to close knowledge gaps

The pilot targeted a persistent problem in large-scale consumer electronics retail: keeping product knowledge consistent across linguistically and geographically diverse sales and reseller teams. Traditional evaluation relies on manager judgment for both soft-skill assessment and factual accuracy, a method AKA says introduces inconsistency and scales poorly across markets and languages.

Evoto Launches 8.0 With Creator Marketplace, $500K Reward Pool

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Evoto Launches 8.0 With Creator Marketplace, $500K Reward Pool

New York – September 22, 2026 -- Evoto AI unveiled Evoto 8.0 at its annual launch event, opening a creator marketplace for photographers to sell presets and creative assets, backed by a $500,000 reward pool. The release spans Evoto Desktop, the Evoto App and Evoto Video, adding an Asset Hub, in-timeline portrait retouching for DaVinci Resolve, story-based culling for high-volume shoots, reusable workflow templates and a production-grade SDK.

Aeonsemi Launches Praxium PHY Family for Physical AI Ethernet

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Aeonsemi Launches Praxium PHY Family for Physical AI Ethernet

Santa Clara, Calif. – September 22, 2026 -- Aeonsemi, Inc. has introduced the Praxium PHY family, a line of multi-gigabit Ethernet transceivers delivering data rates up to 10 Gbps in a 6 x 6 mm QFN package for robots, autonomous vehicles and industrial machines.

Praxium cuts power to as low as 350 mW for 10 Gbps sensor links

The chips support IEEE 802.3ch standards for 10GBASE-T1, 5GBASE-T1 and 2.5GBASE-T1 operation, and use Energy-Efficient Ethernet on lower-speed uplinks to reach the 350 mW figure for asymmetric 10 Gbps connections. The family targets cameras, LiDAR, zone controllers and network backbones inside Physical AI systems where component size and power budgets are constrained.

Axcelis to Showcase SiC Implantation Tech at ICSCRM 2026 in Japan

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Axcelis to Showcase SiC Implantation Tech at ICSCRM 2026 in Japan

Beverly, Mass. – September 21, 2026 -- Axcelis Technologies (NASDAQ: ACLS) will exhibit at the 23rd International Conference on Silicon Carbide and Related Materials (ICSCRM 2026), targeting a silicon carbide device market Yole Group projects to reach $11 billion by 2031, expanding at a 20% compound annual growth rate from 2025 to 2031.

UD info's DB Series SSDs Earn FIPS 140-3 Level 2 Validation

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UD info's DB Series SSDs Earn FIPS 140-3 Level 2 Validation

New Taipei City – September 21, 2026 -- UD info's DB Series SSD Drives have achieved FIPS 140-3 validation from the National Institute of Standards and Technology's Cryptographic Module Validation Program, with NIST Certificate No. 5479 issued August 12, 2026, confirming Overall Level 2 status.

Certificate confirms Overall Level 2 validation for DB Series cryptographic module

The validation provides independent third-party assurance that the DB Series meets federal cryptographic security requirements, addressing procurement mandates in government, critical infrastructure, and other regulated sectors. NIST CMVP validation is a common prerequisite for federal and defense-adjacent storage procurement in the United States.

MetaOptics Secures $10M From White Lion to Build US Metalens Fab

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MetaOptics Secures $10M From White Lion to Build US Metalens Fab

Singapore – September 21, 2026 -- MetaOptics Ltd (Catalist: 9MT) has secured an investment facility of up to US$10 million from White Lion Capital LLC, marking the Singapore-listed metalens maker's first institutional backer from the United States.

White Lion gains rights to up to 40 million new shares under warrant deed

Under the warrant deed, Los Angeles-based White Lion may exercise warrants at its discretion to raise up to US$10 million by issuing up to 40,000,000 new ordinary shares in MetaOptics. The deal arrives one year after MetaOptics listed on the Catalist board of the Singapore Exchange, and follows what the company describes as a period of design and evaluation requests from customers alongside shipped sampling units.

LG Display Launches World's First 720Hz Gaming OLED Panel

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LG Display Launches World's First 720Hz Gaming OLED Panel

Seoul – September 21, 2026 -- LG Display has begun mass production of a 24.5-inch Gaming OLED panel with a 720Hz refresh rate, the highest ever achieved in a gaming OLED display, alongside a 0.02ms response time.

LG Display sets new refresh-rate benchmark for esports monitors

The panel is the first OLED display built specifically for the esports segment, where 24-inch class monitors dominate because they let players view the full screen at a glance. To hit 720Hz at FHD (1920x1080) resolution, LG Display developed a proprietary driving algorithm and an integrated design spanning panel construction to the driving system, reducing motion blur and ghosting in fast-paced genres such as first-person shooter and racing games.